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TEMD5020X01
Vishay Semiconductors
Silicon PIN Photodiode, RoHS Compliant, Released for Lead (Pb)-free Reflow Soldering, AEC-Q101 Released
FEATURES
* Package type: surface mount * Package form: top view * Dimensions (L x W x H in mm): 5 x 4.24 x 1.12 * Radiant sensitive area (in mm2): 4.4 * Product designed and qualified acc. AEC-Q101 for the automotive market * High photo sensitivity * High radiant sensitivity
20535
* Suitable for visible and near infrared radiation * Fast response times * Angle of half sensitivity: = 65 * Floor life: 72 h, MSL 4, acc. J-STD-020 * Lead (Pb)-free reflow soldering * Lead (Pb)-free component in accordance RoHS 2002/95/EC and WEEE 2002/96/EC with
DESCRIPTION
TEMD5020X01 is a high speed and high sensitive PIN photodiode. It is a miniature surface mount device (SMD) including the chip with a 4.4 mm2 sensitive area detecting visible and near infrared radiation.
APPLICATIONS
* High speed photo detectors
PRODUCT SUMMARY
COMPONENT TEMD5020X01 Note Test conditions see table "Basic Characteristics" Ira (A) 35 (deg) 65 0.1 (nm) 430 to 1100
ORDERING INFORMATION
ORDERING CODE TEMD5020X01 Note MOQ: minimum order quantity PACKAGING Tape and reel REMARKS MOQ: 1500 pcs, 1500 pcs/reel PACKAGE FORM Top view
ABSOLUTE MAXIMUM RATINGS
PARAMETER Reverse voltage Power dissipation Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction/ambient Note Tamb = 25 C, unless otherwise specified Acc. reflow solder profile fig. 8 Soldered on PCB with pad dimensions: 4 mm x 4 mm Tamb 25 C TEST CONDITION SYMBOL VR PV Tj Tamb Tstg Tsd RthJA VALUE 60 215 100 - 40 to + 100 - 40 to + 100 260 350 UNIT V mW C C C C K/W
Document Number: 84685 Rev. 1.5, 08-Sep-08
For technical questions, contact: detectortechsupport@vishay.com
www.vishay.com 449
TEMD5020X01
Vishay SemiconductorsSilicon PIN Photodiode, RoHS Compliant, Released for
Lead (Pb)-free Reflow Soldering, AEC-Q101 Released
BASIC CHARACTERISTICS
PARAMETER Forward voltage Breakdown voltage Reverse dark current Diode capacitance Open circuit voltage Temperature coefficient of Vo Short circuit current Temperature coefficient of Ik Reverse light current Angle of half sensitivity Wavelength of peak sensitivity Range of spectral bandwidth Noise equivalent power Rise time Fall time Note Tamb = 25 C, unless otherwise specified VR = 10 V, = 950 nm VR = 10 V, RL = 1 k, = 820 nm VR = 10 V, RL = 1 k, = 820 nm TEST CONDITION IF = 50 mA IR = 100 A, E = 0 VR = 10 V, E = 0 VR = 0 V, f = 1 MHz, E = 0 VR = 3 V, f = 1 MHz, E = 0 Ee = 1 mW/cm2, = 950 nm Ee = 1 mW/cm2, = 950 nm Ee = 1 mW/cm2, = 950 nm Ee = 1 mW/cm2, = 950 nm Ee = 1 mW/cm2, = 950 nm, VR = 5 V SYMBOL VF V(BR) Iro CD CD Vo TKVo Ik TKIk Ira p 0.1 NEP tr tf 25 60 2 48 17 350 - 2.6 32 0.1 35 65 900 430 to 1100 4 x 10-14 100 100 40 30 MIN. TYP. 1 MAX. 1.3 UNIT V V nA pF pF mV mV/K A %/K A deg nm nm W/Hz ns ns
BASIC CHARACTERISTICS
Tamb = 25 C, unless otherwise specified
I ra rel - Relative Reverse Light Current
1000
Iro - Reverse Dark Current (nA)
1.4
1.2
100
VR = 5 V = 950 nm
1.0
10
0.8
VR = 10 V 1 20 40 60 80 100
0.6 0 20 40 60 80 100 Tamb - Ambient Temperature (C)
94 8403
Tamb - Ambient Temperature (C)
94 8409
Fig. 1 - Reverse Dark Current vs. Ambient Temperature
Fig. 2 - Relative Reverse Light Current vs. Ambient Temperature
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For technical questions, contact: detectortechsupport@vishay.com
Document Number: 84685 Rev. 1.5, 08-Sep-08
TEMD5020X01
Silicon PIN Photodiode, RoHS Compliant, Released for Vishay Semiconductors Lead (Pb)-free Reflow Soldering, AEC-Q101 Released
1000
S ( )rel - Relative Spectral Sensitivity
Ira - Reverse Light Current (A)
1.0 0.8 0.6 0.4 0.2 0 350 550 750 950 1150
- Wavelength (nm)
100
10
1
VR = 5 V = 950 nm
0.1 0.01
94 8421
0.1 1 Ee - Irradiance (mW/cm 2)
10
94 8420
Fig. 3 - Reverse Light Current vs. Irradiance
Fig. 6 - Relative Spectral Sensitivity vs. Wavelength
100 Ira - Reverse Light Current (A)
0
10
20 30
1 mW/cm2 0.5 mW/cm2 10
Srel - Relative Radiant Sensitivity
= 950 nm
40 1.0 0.9 0.8 50 60 70 80 0.6 0.4 0.2 0
0.2 mW/cm2 0.1 mW/cm
2
0.05 mW/cm 1 0.1 1 10
2
0.7
100
94 8406
94 8422
VR - Reverse Voltage (V)
Fig. 4 - Reverse Light Current vs. Reverse Voltage
Fig. 7 - Relative Radiant Sensitivity vs. Angular Displacement
80 CD - Diode Capacitance (pF)
60
E=0 f = 1 MHz
40
20
0 0.1
94 8423
1
10
100
VR - Reverse Voltage (V)
Fig. 5 - Diode Capacitance vs. Reverse Voltage
Document Number: 84685 Rev. 1.5, 08-Sep-08
For technical questions, contact: detectortechsupport@vishay.com
www.vishay.com 451
- Angular Displacement
TEMD5020X01
Vishay SemiconductorsSilicon PIN Photodiode, RoHS Compliant, Released for
Lead (Pb)-free Reflow Soldering, AEC-Q101 Released
PACKAGE DIMENSIONS in millimeters
Drawing-No.: 6.541-5059.01-4 Issue: 4; 26.04.07
19280
Not indicated tolerances 0.1
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For technical questions, contact: detectortechsupport@vishay.com
Document Number: 84685 Rev. 1.5, 08-Sep-08
TEMD5020X01
Silicon PIN Photodiode, RoHS Compliant, Released for Vishay Semiconductors Lead (Pb)-free Reflow Soldering, AEC-Q101 Released
TAPING DIMENSIONS in millimeters
20537
REEL DIMENSIONS in millimeters
20874
Document Number: 84685 Rev. 1.5, 08-Sep-08
For technical questions, contact: detectortechsupport@vishay.com
www.vishay.com 453
TEMD5020X01
Vishay SemiconductorsSilicon PIN Photodiode, RoHS Compliant, Released for
Lead (Pb)-free Reflow Soldering, AEC-Q101 Released
SOLDER PROFILE DRYPACK
300 250 255 C 240 C 217 C max. 260 C 245 C
Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant.
Temperature (C)
200 max. 30 s 150 max. 120 s 100 50 0 0 50 100 150 200 250 300 max. ramp up 3 C/s max. ramp down 6 C/s max. 100 s
FLOOR LIFE
Time between soldering and removing from MBB must not exceed the time indicated in J-STD-020: Moisture sensitivity: level 4 Floor life: 72 h Conditions: Tamb < 30 C, RH < 60 %
DRYING
In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or recommended conditions: 192 h at 40 C (+ 5 C), RH < 5 % or 96 h at 60 C (+ 5 C), RH < 5 %.
19841
Time (s)
Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D
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For technical questions, contact: detectortechsupport@vishay.com
Document Number: 84685 Rev. 1.5, 08-Sep-08
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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